SMD – Product Series

(products below: SMD 0805 | SMD 1206)

Temperature Range: –50°C...+150/250°C

Platinum temperature sensor elements in SMD construction
Soldering junction (reflow solderable)

Specification:	DIN EN 60751
Temperature range:	-50°C to +150°C (2P), -50°C to +250°C (3P, 4P)
Temperature Coefficient:	TCR = 3850 ppm/K
Classes:	F 0.15 (Class A)           -50°C to +150/ 250°C F 0.3 (Class B)             -50°C to +150/ 250°C F 0.6 (Class C)             -50°C to +150/ 250°C
Contact connection:	Contacts around the sides: 2P = Contacts tin-coated (96.5Sn/3Ag/0.5Cu), LMP lead free, reflow soldering 3P = Contacts tin-coated (5Sn/93.5Pb/1.5Ag), HMP, reflow soldering 4P = Contacts gold plated, solderable layer The precision class is dependent on the soldering process
Solderability:	235°C £ 8s (DIN IEC 68 T2-20, Ta Meth. 1)
Resistance to soldering heat:	260°C 10s (DIN IEC 68 T2-20, Ta Meth. 1A)
Long-term stability:	max. Drift = 0.04% after 1000h at 130°C

SMD 0805

Chip Dimensions, LxW:	2.0 x 1.2 mm
Nominal Resistance at 0°C (ohm) :	100/500/1000
Self Heating, (mK):	Water (v= 0 m/s)	∆Tw = 2.6 at 0°C
	Air (v= 0 m/s)	∆Ta  = 25 at 0°C
Response Time (s):	Water (v= 0.4 m/s)	T0.5   = 0.10
		T0.63 = 0.12
		T0.9   = 0.33
	Air (v= 1 m/s)	T0.5   = 2.5
		T0.63 = 3
		T0.9   = 8
Measuring Current (mA)	100Ω: 1
	500Ω: 0.5
	1000Ω: 0.3

SMD 1206

Dimensions, LxW:	3.0 x 1.6
Nominal Resistance at 0°C (ohm):	100/500/1000
Self Heating (mK):	Water (v= 0 m/s)	∆Tw = 1.8 at 0°C
	Air (v= 0 m/s)	∆Ta  = 14 at 0°C
Response Time (s):	Water (v= 0.4 m/s)	T0.5   = 0.15
		T0.63 = 0.25
		T0.9   = 0.45
	Air (v= 1 m/s)	T0.5   = 3.5
		T0.63 = 4.2
		T0.9   = 10
Measuring Current (mA):	100Ω: 1
	500Ω: 0.5
	1000Ω: 0.3

Order Example:
P	1K0	0805.	2P.	B
1	2	3	4	5
1.  Material Identification = Platinum temperature sensor 2.  Resistance Value in ohm = 1000Ω / 0°C 3.  Chip Dimension = 2.0 x 1.2 mm 4.  Contact Connection = Tin-coated contacts, LMP, lead free 5.  Tolerance Class = DIN EN 60751 F 0.3 (former Class B)